Acid copper bath Acid copper · copper sulphate and sulphuric acid
The bath
| Ingredient | Per litre | Role |
|---|---|---|
| Copper sulphate, pentahydrate | 200 g | Metal source |
| Sulphuric acid, concentrated | 30 ml | Conductivity, throwing power |
| Hydrochloric acid 30 % | 0.2 ml | Chloride, about 60 mg/l — needed for the anode to dissolve evenly |
| Deionised water | to 1 l | Carrier |
Dissolve the copper sulphate in most of the water first, then pour the acid into the solution, slowly and with stirring. Never the other way round. The mixture gets noticeably hot.
About the chloride
Those two tenths of a millilitre look like a typo but are decisive. Without chloride the phosphorised copper anode passivates, stops dissolving evenly, and the bath loses copper. Too much chloride gives a pitted, matt deposit instead. The window is roughly 40–80 mg/l.
Brighteners
Without additives the copper comes out dull and coarse-grained. Three components are used industrially: a carrier (polyethylene glycol), a brightener (SPS, bis-sodium sulphopropyl disulphide) and a leveller (Janus Green B). Buy a ready-made additive set for circuit boards — mixing them yourself is not worth the trouble.
An honest home alternative: a few drops of molasses or a pinch of gelatin per litre gives a fine-grained, semi-bright deposit. Not a mirror, but far better than nothing.
Use for
- A levelling base layer under nickel and chrome. Copper is soft and fills microscopic unevenness.
- Building up worn parts that are then turned or ground to size.
- Electroforming — building a free-standing copper shell on a model that is then removed.
- A conductive layer on plastic after graphiting.
In an acid copper bath, copper deposits chemically on iron and zinc before the current has done anything — a loose, brown-red film with no adhesion. Lay down alkaline copper or nickel first.